About this scholarly article

2012 4th Electronic System-Integration Technology Conference - Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration by Landesberger, Christof; Scherbaum, Sabine; Weber, Josef; Bock, Karlheinz; Hiroshima, Mitsuru; Oberhofer, Bernhard is a scholarly article available to read on EtoBox.

Author

Landesberger, Christof; Scherbaum, Sabine; Weber, Josef; Bock, Karlheinz; Hiroshima, Mitsuru; Oberhofer, Bernhard

Publisher

IEEE

Published

2012

Language

EN