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About this Engineering article
In Situ Observation of Ultrasonic Flip-chip Bonding Using High-speed Camera by Shuto, Takanori; Asano, Tanemasa is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Shuto, Takanori; Asano, Tanemasa
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)