About this scholarly article

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging - Modeling of multiconductor microstrip bend discontinuities by Boussetta, C.; Ndagijimana, F.; Chilo, J. is a scholarly article available to read on EtoBox.

Author

Boussetta, C.; Ndagijimana, F.; Chilo, J.

Publisher

IEEE

Published

1994