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DBpia 4 by kr6b5f7yt5 is a document available to read on EtoBox.

What is DBpia 4 about?

The document presents mechanical properties of C/SiC composites, including density, porosity, coefficient of thermal expansion, and thermal conductivity. It also discusses the tensile and compressive specimens of C/SiC and mentions the use of liquid silicon infiltration (LSI) in the manufacturing process. The data is supported by references to ASTM standards and specific research studies.

Author
kr6b5f7yt5
Language
EN