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What is DBpia 4 about?
The document presents mechanical properties of C/SiC composites, including density, porosity, coefficient of thermal expansion, and thermal conductivity. It also discusses the tensile and compressive specimens of C/SiC and mentions the use of liquid silicon infiltration (LSI) in the manufacturing process. The data is supported by references to ASTM standards and specific research studies.
- Author
- kr6b5f7yt5
- Language
- EN