About this scholarly article

2008 9th International Conference on Solid-State and Integrated-Circuit Technology - Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package by Uchibori, Chihiro J.; Xuefeng Zhang, ; Ho, Paul S.; Nakamura, T. is a scholarly article available to read on EtoBox.

Author

Uchibori, Chihiro J.; Xuefeng Zhang, ; Ho, Paul S.; Nakamura, T.

Publisher

IEEE

Published

2008