Skip to content

Opening book details…

About this Engineering article

Material Reliability and Integration Issues of Polyimide and Benzocyclobutene Interlayer Dielectric Materials by Zantye, Parshuram B. ;Kumar, Ashok ;Gopalkrishnan, R. ;Balakumar, S. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Zantye, Parshuram B. ;Kumar, Ashok ;Gopalkrishnan, R. ;Balakumar, S.
Publisher
Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
Published
2005
Field
Engineering (Physical Sciences)

More by Zantye, Parshuram B. ;Kumar, Ashok ;Gopalkrishnan, R. ;Balakumar, S.

Browse all works by Zantye, Parshuram B. ;Kumar, Ashok ;Gopalkrishnan, R. ;Balakumar, S.