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About this Physics and Astronomy article
Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect by Ouyang, Fan-Yi; Jhu, Wei-Cheng is a Physics and Astronomy article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Physics and Astronomy.
- Author
- Ouyang, Fan-Yi; Jhu, Wei-Cheng
- Publisher
- American Institute of Physics; AIP Publishing; Publons (ISSN 0021-8979)
- Published
- 2013
- Language
- EN
- Field
- Physics and Astronomy (Physical Sciences)