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About this Engineering article
Comparison of Radio Frequency and Microwave Plasma Treatments on LED Chip Bond Pad for Wire Bond Application by Peng, Hui Yuen; Devarajan, Mutharasu; Lee, Teik Toon; Lacey, David is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Peng, Hui Yuen; Devarajan, Mutharasu; Lee, Teik Toon; Lacey, David
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)
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