About this scholarly article

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Simulation and experiments of fan-out wafer level package during encapsulation by Shang-Shiuan Deng, ; Sheng-Jye Hwang, ; Huei-Huang Lee, ; Durn-Yuan Huang, ; Yu-Ren Chen, ; Geng-Shin Shen, is a scholarly article available to read on EtoBox.

Author

Shang-Shiuan Deng, ; Sheng-Jye Hwang, ; Huei-Huang Lee, ; Durn-Yuan Huang, ; Yu-Ren Chen, ; Geng-Shin Shen,

Publisher

IEEE

Published

2009

Language

EN