About this scholarly article

2009 International Conference on Electronic Packaging Technology & High Density Packaging - On variable frequency microwave processing of heterogeneous chip-on-board assemblies by Tilford, T.; Pavuluri, S.; Bailey, C.; Desmulliez, M. P. Y. is a scholarly article available to read on EtoBox.

Author

Tilford, T.; Pavuluri, S.; Bailey, C.; Desmulliez, M. P. Y.

Publisher

IEEE

Published

2009