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About this Engineering article
Adhesion of Thin Films of Evaporated Titanium–copper After Electroplating by Kemmerer, C. T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kemmerer, C. T.
- Publisher
- AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0022-5355)
- Published
- 1979
- Field
- Engineering (Physical Sciences)