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About this Engineering article
Direct Writing and Lift-Off Patterning of Copper Lines at 200°C Maximum Process Temperature by Hong, C. M.; Gleskova, H.; Wagner, S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hong, C. M.; Gleskova, H.; Wagner, S.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1997
- Field
- Engineering (Physical Sciences)