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Metallization involves depositing metal layers on semiconductor wafers for electrical connections, crucial in backend-of-line processing. Key applications include interconnects, contact formation, and gate metallization, with materials like copper and aluminum chosen based on properties like resistivity and electromigration resistance. Various deposition methods such as Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) are used, each with distinct advantages for specific applications.
- Author
- siddharthyadav830
- Language
- EN