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About this Engineering article
Stress and Warpage Studies of Silicon Based Plain and Patterned Films During Rapid Thermal Processing (RTP) by Thakur, R.P.S.; Martin, A.; Fackrell, W.T.; Barbour, R.; Kawski, J. L.; Perroots, L. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Thakur, R.P.S.; Martin, A.; Fackrell, W.T.; Barbour, R.; Kawski, J. L.; Perroots, L.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1993
- Field
- Engineering (Physical Sciences)