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The document compares Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) methods, detailing various PVD techniques such as evaporation and sputtering. It outlines specific types of evaporation methods including thermal and electron beam evaporators, as well as sputtering methods like DC diode and magnetron sputtering. Magnetron sputtering is highlighted as the most widely used PVD system due to its superior uniformity and efficiency.

Author

yongfeng jia

Language

EN