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About this Engineering article
Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C by Obaid, Ahmad Abu; Sloan, Jay G.; Lamontia, Mark A.; Paesano, Antonio; Khan, Subhotosh; Gillespie, John J. is a Engineering article available to read on EtoBox.
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- Author
- Obaid, Ahmad Abu; Sloan, Jay G.; Lamontia, Mark A.; Paesano, Antonio; Khan, Subhotosh; Gillespie, John J.
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 2004
- Field
- Engineering (Physical Sciences)