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About this Engineering article
Electrical-thermal Characterization of Through Packaging Vias in Glass Interposer by qian, libo; Xia, Yinshui; Shi, Ge; Wang, Jian; Ye, Yidie; Du, Shimin is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- qian, libo; Xia, Yinshui; Shi, Ge; Wang, Jian; Ye, Yidie; Du, Shimin
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1536-125X)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)
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