About this document
Stencil Design for SMT and Through-Hole by Robert Martos is a document available to read on EtoBox.
This document discusses stencil design considerations for mixed through-hole and SMT component placement and reflow. Key factors discussed include through-hole component material selection, pin type, lead length, and standoff height. PCB design parameters like plated through-hole size, pad size, board thickness, and solder mask type are also reviewed. Three stencil designs are considered: single thickness stencils with oversized apertures, step stencils with oversized apertures, and thick stencils for print
- Author
- Robert Martos
- Language
- EN