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ONSPR3383 Topcool MOSFETS News Release FINAL 11.15.2022 by Minh Hung Nguyen is a document available to read on EtoBox.

What is ONSPR3383 Topcool MOSFETS News Release FINAL 11.15.2022 about?

onsemi has launched a new series of MOSFET devices featuring innovative top-side cooling, aimed at enhancing design efficiency in automotive applications. The TCPAK57 package allows for improved heat dissipation and increased power density, while maintaining high electrical efficiency with low R DS(ON) values. Samples are available now, with full-scale manufacturing set for January 2023.

Author

Minh Hung Nguyen

Language

EN