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Can I read Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys on EtoBox?
Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys by Shaoyu Li; Xingrui Luo; Zhe Sun; Huarui Zhou; Shiyu Xiong; Baixiong Liu; Longfei Zeng; Bin Yang is a Materials Science article available to read on EtoBox.
What is Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys about?
Copper (Cu) based materials desire superior mechanical properties and high conductivity for potential industry application. In this work, a specially designed dual heterogeneous lamella structure (DHLS) was produced in Cu alloy by powder metallurgy and deformation heat treatment. It is characterized by soft micrograined lamellae embedded inside a hard matrix of ultrafine grains containing nano-sized precipitations. Such dramatic microstructure heterogeneities produce strong back stress hardening, which led to substantially improved ultimate tensile strength (530.5 MPa) without greatly sacrificing the original ductility. In addition, the recrystallization of micrograined lamellae and the aging precipitation of ultrafine grains result in the high conductivity. This study offers a workable strategy to using DHLS to optimize the comprehensive Cu-based materials with an excellent strength-electrical conductivity combination.
Who reads Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys?
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Shaoyu Li; Xingrui Luo; Zhe Sun; Huarui Zhou; Shiyu Xiong; Baixiong Liu; Longfei Zeng; Bin Yang
- Publisher
- Elsevier BV
- Published
- 2023
- Language
- EN
- Field
- Materials Science (Physical Sciences)