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About this Engineering article
Thermal-Aware Floorplanning with Min-cut Die Partition for 3D ICs by Jang, Cheoljon (author);Chong, Jong Wha (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jang, Cheoljon (author);Chong, Jong Wha (author)
- Publisher
- ETRI
- Published
- 2014
- Field
- Engineering (Physical Sciences)
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