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About this Engineering article

High Aspect Ratio Micro- and Nano-machining of Silicon Using Time-multiplexed Reactive Ion Etching by Sanaee, Z; Poudineh, M; Abdolahad, M; Mohajerzadeh, S is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Sanaee, Z; Poudineh, M; Abdolahad, M; Mohajerzadeh, S
Publisher
Institute of Physics; IOP Publishing; Institute of Physics Publishing; ScienceOpen (ISSN 0960-1317)
Published
2011
Language
EN
Field
Engineering (Physical Sciences)