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About this Engineering article
Effects of Deep Reactive Ion Etching Parameters on Etching Rate and Surface Morphology in Extremely Deep Silicon Etch Process with High Aspect Ratio by Xu, Tiantong; Tao, Zhi; Li, Hanqing; Tan, Xiao; Li, Haiwang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Xu, Tiantong; Tao, Zhi; Li, Hanqing; Tan, Xiao; Li, Haiwang
- Publisher
- SAGE Publications; SAGE Publications Inc.; New York NY: Hindawi Pub. Corp.; [London]: SAGE Publications Ltd (ISSN 1687-8132)
- Published
- 2017
- Field
- Engineering (Physical Sciences)
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