About this scholarly article

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Electrical evaluation of flip-chip package alternatives for next generation microprocessors by Darnauer, J.; Chengson, D.; Schmidt, B.; Priest, E.; Petefish, B.; Hanson, D.; Gore, W.L. is a scholarly article available to read on EtoBox.

Author

Darnauer, J.; Chengson, D.; Schmidt, B.; Priest, E.; Petefish, B.; Hanson, D.; Gore, W.L.

Publisher

IEEE

Published

1998