Can I read Leveling and Microstructural Effects of Additives For Copper Electrodeposition on EtoBox?

Leveling and Microstructural Effects of Additives For Copper Electrodeposition by ejcy is a document available to read on EtoBox.

What is Leveling and Microstructural Effects of Additives For Copper Electrodeposition about?

The study investigates the effects of two additives, bis(3-sulfopropyl) disulfide (SPS) and Janus Green B (JGB), on copper electrodeposition from an acid-copper sulfate electrolyte. It was found that leveling occurs only when all four additives are present, indicating the importance of additive interactions, and that SPS modifies the microstructure by removing columnar structures and reducing grain size when combined with JGB. The research highlights the need for a fundamental understanding of additive mech

Author

ejcy

Language

EN