Opening book details…
About this Engineering article
A New Evaluation Method of Silicon Wafer Bonding Interfaces and Bonding Strength by KOH Etching by MITani, Kiyoshi; Feijoo, Diego; Cha, Giho; Gösele, Ulrich M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- MITani, Kiyoshi; Feijoo, Diego; Cha, Giho; Gösele, Ulrich M.
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 1992
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by MITani, Kiyoshi; Feijoo, Diego; Cha, Giho; Gösele, Ulrich M.
Browse all works by MITani, Kiyoshi; Feijoo, Diego; Cha, Giho; Gösele, Ulrich M.