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About this Engineering article
Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- The Electrochemical Society (ISSN 2151-2043)
- Published
- 2006
- Field
- Engineering (Physical Sciences)