About this scholarly article

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging by Bhogaraju, Sri Krishna; Mokhtari, Omid; Pascucci, Jacopo; Hanss, Alexander; Schmid, Maximilian; Conti, Fosca; Elger, Gordon is a scholarly article available to read on EtoBox.

Author

Bhogaraju, Sri Krishna; Mokhtari, Omid; Pascucci, Jacopo; Hanss, Alexander; Schmid, Maximilian; Conti, Fosca; Elger, Gordon

Publisher

IEEE

Published

2019

Language

EN