About this scholarly article

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Thermal performance of high power LED package based on LTCC by Ma, Mingsheng; Liu, Zhifu; Li, Yongxiang is a scholarly article available to read on EtoBox.

Author

Ma, Mingsheng; Liu, Zhifu; Li, Yongxiang

Publisher

IEEE

Published

2011

Language

EN