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About this Engineering article
In Situ Trench Etching and Releasing Technique of High Aspect Ratio Beams Using Magnetically Enhanced Reactive Ion Etching by Kok, Kitt Wai; Yoo, Won Jong; Sooriakumar, K. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kok, Kitt Wai; Yoo, Won Jong; Sooriakumar, K.
- Publisher
- AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0734-211X)
- Published
- 2002
- Language
- EN
- Field
- Engineering (Physical Sciences)
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