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About this Engineering article
Growth of Voids in Metals During Diffusion and Creep by R.W Balluffi; L.L Seigle is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- R.W Balluffi; L.L Seigle
- Publisher
- Elsevier Science; Elsevier ; University of Toronto Press; Elsevier BV (ISSN 0001-6160)
- Published
- 1957
- Language
- EN
- Field
- Engineering (Physical Sciences)