About this scholarly article

2014 IEEE International Electron Devices Meeting - High-precision wafer-level Cu-Cu bonding for 3DICs by Okada, Masashi; Sugaya, Isao; Mitsuishi, Hajime; Maeda, Hidehiro; Shimoda, Toshimasa; Izumi, Shigeto; Nakahira, Hosei; Okamoto, Kazuya is a scholarly article available to read on EtoBox.

Author

Okada, Masashi; Sugaya, Isao; Mitsuishi, Hajime; Maeda, Hidehiro; Shimoda, Toshimasa; Izumi, Shigeto; Nakahira, Hosei; Okamoto, Kazuya

Publisher

IEEE

Published

2014

Language

EN