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The Patterning of Fine-pitch Electrical Interconnections on Non-planar Substrates: a Comparison Between Methods Utilising Laser Ablation and Electro-deposited Photoresist by Gavin L. Williams; Ian Wallhead; Veena Sarojiniamma; Peter A. Ivey; N.Luke Seed is a Engineering article available to read on EtoBox.

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This paper compares and contrasts two methods that we have developed for patterning fine-pitch, electrical interconnections onto grossly non-planar surfaces. The first method involves the selective ablation of nickel using a YAG laser. The optimisation of the laser process is discussed. The second method employs an electro-depositable photoresist (EDPR) (Shipley PEPR2400) to pattern a copper seed layer that is then overplated with nickel. The substrate studied is a piezo-electric ink-jet print head that requires up to one thousand 80 m-pitch interconnections over a step height of 500 m. The two technologies are found to be complementary, with laser patterning offering greater flexibility for product development and EDPR patterning offering a higher throughput for mass-production.

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Author

Gavin L. Williams; Ian Wallhead; Veena Sarojiniamma; Peter A. Ivey; N.Luke Seed

Publisher

Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-4247)

Published

2004

Language

EN

Field

Engineering (Physical Sciences)