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This paper discusses advancements in packaging technologies aimed at achieving over 20 Tb/s/mm die-to-die bandwidth density, focusing on doubling signaling speeds to 64 Gb/s. It highlights the importance of optimizing bump maps, enhancing signal integrity, and improving power delivery to meet the increasing demands of integrated AI technologies. The findings indicate that while higher speeds require more power and ground bumps, careful design can mitigate crosstalk and maintain efficiency in power consumpti

Author

skylightshing

Language

EN