About this scholarly article

2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Validation of submodel technique for fracture evaluation in wafer-level package under thermal loading by ZHANG, Min; QIN, Fei; DAI, Yanwei; AN, Tong; CHEN, Pei is a scholarly article available to read on EtoBox.

Author

ZHANG, Min; QIN, Fei; DAI, Yanwei; AN, Tong; CHEN, Pei

Publisher

IEEE

Published

2019