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About this Engineering article
Adhesive Polymer Bonding Method for Integration of III-V Thin-Film Optoelectronic Devices Onto Silicon Substrate by Xiao, Jing; Chaudhuri, Ritesh Ray; Seo, Sang-Woo is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Xiao, Jing; Chaudhuri, Ritesh Ray; Seo, Sang-Woo
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2018
- Field
- Engineering (Physical Sciences)
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