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About this Engineering article
High Density Interconnect for Advanced VLSI Packaging by Adams, A.C.; Bentson, R.S.; Bertram, W.J.; Levinstein, H.J.; McKnight, W.Q.; Rubin, Jacques J.; ter Haar, B.A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Adams, A.C.; Bentson, R.S.; Bertram, W.J.; Levinstein, H.J.; McKnight, W.Q.; Rubin, Jacques J.; ter Haar, B.A.
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd (ISSN 1662-9507)
- Published
- 1988
- Language
- EN
- Field
- Engineering (Physical Sciences)