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MKS Instruments Handbook: Semiconductor Devices and Process Technology - 9-2017 Acknowledgements Forward Table of Contents SECTION A - Semiconductor Device Physics, Materials and Fabrication I. Semiconductor Physics and Basic Device Structures A. Semiconductor Physics 1. Electrical Characteristics of Solids 2. Electrical Conduction in Semiconductors B. Basic Device Structures 1. P-N Junction 2. Diodes 3. Bipolar Junction Transistor 4. MOSFET 5. FinFETs 6. Other Common Semiconductor Devices II. Semiconductor Materials A. Bulk Crystalline Silicon and Compound Semiconductors 1. Electronic Grade Polycrystalline Silicon (Polysilicon) 2. Single Crystal Silicon Wafer Manufacture 3. Compound Semiconductor Wafer Production B. Thin Films for Device Fabrication 1. Polycrystalline Silicon Thin Films 2. Epitaxial Thin Films 3. Dielectric Thin Films 4. Metal Thin Films for Contacts and Interconnects III. Example Fabrication Process: CMOS Devices A. Wafer Surface Cleaning 1. Contaminant Types and Solution Cleaning Methods B. CMOS Device Structure C. CMOS Process Steps 1. Pad Oxide (Thermal Oxidation) 2. Silicon Nitride 3. Shallow Trench Isolation (STI) Process 4. N- and P-Well Process 5. Gate Pro
Who reads MKS Instruments Handbook Semiconductor Devices and Process Technology?
It is typically read by self-directed learners exploring a subject in depth.
Common subject areas: history, science, philosophy, social sciences.
- Author
- MKS Instruments
- Published
- 2017
- Language
- EN
- Category
- nonfiction
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