About this scholarly article

1994 Proceedings. 44th Electronic Components and Technology Conference - A reliable thermosonic wire bond of GaAs-devices analysed by infrared-microscopy by Weiss, S.; Zakel, E.; Reichl, H. is a scholarly article available to read on EtoBox.

Author

Weiss, S.; Zakel, E.; Reichl, H.

Publisher

IEEE

Published

1994

Language

EN