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Influence of reactive gas pressure on the deposition of an AlN protective film for organic photoconductor by X.S. Miao; Y.C. Chan; E.Y.B. Pun is a Engineering article available to read on EtoBox.

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The deposition of a protective AlN film for hardening and smoothing of organic photoconductor OPC surface is an effective method to prolong the operating lifetime of the OPC. In this work, the electrophotographic properties, surface microhardness and surface roughness of AlN coated OPC as a function of N gas pressure during the sputtering of AlN film were systematically studied and 2 optimized. When the N partial pressure increases, the surface roughness increases and the surface hardness decreases. When the N 2 2 y1 Ž . pressure is around 2.7 = 10 Pa 2 mTorr , the electrophotographic properties reach optimized conditions. When the pressure is y1 Ž . increased to 5.3 = 10 Pa 4 mTorr , the surface roughness increases quickly, the surface hardness decreases, and the electrophotographic properties can deteriorate quickly as a result of the target poisoning phenomenon during the sputtering process. From this work, it is clearly shown that the deposition of AlN protective film can effectively increase the surface hardness of an OPC without causing a deterioration on the electrophotographic properties of the OPC, thereby prolonging the operating lifetime of the OPC. In fact, AIN coated O

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Author

X.S. Miao; Y.C. Chan; E.Y.B. Pun

Publisher

Elsevier Science; Elsevier ; Elsevier Sequoia; Elsevier BV (ISSN 0040-6090)

Published

1998

Language

EN

Field

Engineering (Physical Sciences)