About this scholarly article

SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 25 January 2003)] Reliability, Testing, and Characterization of MEMS/MOEMS II - Solder bonding for microelectricalmechanical systems (MEMS) applications by Goyal, Abhijat; Tadigadapa, Srinivas; Islam, Rafiqul; Ramesham, Rajeshuni; Tanner, Danelle M. is a scholarly article available to read on EtoBox.

Author

Goyal, Abhijat; Tadigadapa, Srinivas; Islam, Rafiqul; Ramesham, Rajeshuni; Tanner, Danelle M.

Publisher

SPIE

Published

2003