About this scholarly article

1998 3rd International Symposium on Plasma Process-Induced Damage (Cat. No.98EX100) - Reduction of plasma process-induced damage during gate poly etching by using a SiO/sub 2/ hard mask by Lee, H.C.; Creusen, M.; Groeseneken, G.; Vanhaelemeersch, S. is a scholarly article available to read on EtoBox.

Author

Lee, H.C.; Creusen, M.; Groeseneken, G.; Vanhaelemeersch, S.

Publisher

American Vacuum Soc

Published

1998

Language

EN