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What is Pulse-Reverse Plating On Copper about?

This study investigates the effects of pulse-reverse (PR) electroplating on the thermal mechanical properties and microstructure of copper in high aspect-ratio plating through holes (PTHs) for automotive printed circuit boards. The results show that PR electroplating improves copper deposition uniformity compared to direct current (DC) methods, but cracks formed in the copper plating after thermal cycling tests, particularly at longer pulse-reverse times. The findings highlight the relationship between elec

Author

l131003y

Language

EN