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About this Engineering article
Moisture induced interface weakening in ACF package by Gi-Dong Sim; Chang-Kyu Chung; Kyung-Wook Paik; Soon-Bok Lee is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Gi-Dong Sim; Chang-Kyu Chung; Kyung-Wook Paik; Soon-Bok Lee
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0921-5093)
- Published
- 2010
- Language
- EN
- Field
- Engineering (Physical Sciences)
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