About this scholarly article

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling by Kamrul Hasan, S. M.; Fahim, Abdullah; Suhling, Jeffrey C.; Hamasha, Sa'd; Lall, Pradeep is a scholarly article available to read on EtoBox.

Author

Kamrul Hasan, S. M.; Fahim, Abdullah; Suhling, Jeffrey C.; Hamasha, Sa'd; Lall, Pradeep

Publisher

IEEE

Published

2019

Language

EN