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What is Micromechanical Testing with DAGE 4000Plus about?

This document discusses the challenges of micromechanical testing of thin semiconductor die less than 100 microns thick, as their increased flexibility requires new testing techniques. It describes how cantilever bending has replaced traditional 3-point bending for testing die under 50 microns. Bond testing of stacked die in system-in-package designs also presents challenges addressed through specialized test frames and software that enable soft landing and deflection-controlled shear testing of thin, flexi

Author

Thanalachmy Gopi

Language

EN