About this scholarly article

2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Bias-dependent high frequency characterization of through-silicon via (TSV) for 3D integration by Xin Sun, ; Runiu Fang, ; Huan Liu, ; Min Miao, ; Yufeng Jin, is a scholarly article available to read on EtoBox.

Author

Xin Sun, ; Runiu Fang, ; Huan Liu, ; Min Miao, ; Yufeng Jin,

Publisher

IEEE

Published

2016