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About this Engineering article
Cyclic Creep and Fatigue Testing of Nanocrystalline Copper Thin Films by Hu, T.-C.; Wang, Y.-T.; Hsu, F.-C.; Sun, P.-K.; Lin, M.-T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hu, T.-C.; Wang, Y.-T.; Hsu, F.-C.; Sun, P.-K.; Lin, M.-T.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0257-8972)
- Published
- 2013
- Language
- EN
- Field
- Engineering (Physical Sciences)