About this scholarly article

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect by Cai, Jian; Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wang, Dejun; Seo, Sun-Kyoung; Cho, Tae-Je is a scholarly article available to read on EtoBox.

Author

Cai, Jian; Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wang, Dejun; Seo, Sun-Kyoung; Cho, Tae-Je

Publisher

IEEE

Published

2015

Language

EN