About this scholarly article

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - The influence of alloying elements on metastable NiSn4 in Sn-Ag solders on Ni-containing metallizations by Belyakov, S.A.; Gourlay, C.M. is a scholarly article available to read on EtoBox.

Author

Belyakov, S.A.; Gourlay, C.M.

Publisher

IEEE

Published

2015

Language

EN